5th RTD Framework Programme

Success stories - IST

IST (Information Society Technologies)

Project details

Project reference:	IST-1999-12529
Acronym:	PROFIT
Title:	Prediction of Temperature Gradients Influencing the Quality of Electronic Products
Subject Index:	Information Processing, Information Systems; Innovation, Technology Transfer
Objectives:	Objective: Many business objectives related to yield, performance, reliability or safety are functions of temperature (gradients). PROFIT aims to create methods and tools to enable a timely assessment of these objectives in all stages of the product creation process. Today's analyses are seriously hampered by the lack of methods to predict temperature gradients in time and space at package, board and system level with sufficient accuracy. The project aims to overcome these drawbacks by major improvements in experimental techniques to acquire input data, in non-linear parameter estimation methods and in transient thermal characterisation of components. Standardisation is considered an important deliverable. Ultimately, the results are suited for implementation in emerging virtual prototyping methods and physic-based reliability analysis software. Objectives: Safety, performance and reliability of electronic products are a function of temperature. Higher accuracy in temperature predictability gives better control of design and manufacturing. Higher-quality products have a positive impact on the product's life-cycle-cost and people's quality of life. Industrial problems: 1. Cost/weight reduction with better quality 2. Physics-based prediction of reliability 3. Yield improvement of packages 4. Awareness of problems due to the absence of useful design specs 5. Standardisation of thermal characterisation. Solutions offered by PROFIT: 1. Significant improvements in temperature prediction for virtual prototyping 2. Accurate predictability of temperature gradients in time and space 3. Better-defined rejection criteria based on in-line quality testing 4. Dissemination of combined thermal expertise in EU through international contacts. Work description: The work will be directed towards major improvements in thermal analysis of the whole electronic design chain, from device via package and board to system. Important data required for accurate numerical analysis are lacking: interface resistances, emissivities, local boundary conditions and local board thermal conductivities, for which test setups will be built based on transient temperature measurements. Transient measurements at device and package level will be performed to assess their quality. Analysis of the data will be treated by using novel non-linear parameter estimation methods. Software will be improved, developed and integrated to facilitate the application of the project results in performance and reliability calculations. Various demonstrators showing the final deliverables are foreseen. The EU lead in thermal characterisation of steady-state compact models will be extended to the transient domain. Yearly workshops will be organised to promote discussion amongst experts, and to facilitate early standardisation. In short, the innovative elements are: - Novel statistical approach for the optimisation of experiments, analysis of transient data and generation of compact models. - Novel measurement techniques for the acquisition of input data. - Novel electrothermal and thermomechanical board/system level software. - New proposals for the standardisation of transient thermal characterisation. The Workpackages show clearly the required elements of the design chain: device, package, board, system. All parties needed to fulfil the objectives are in the consortium: semiconductor manufacturers, system makers, thermal software vendors, an SME focussing on statistics, a university specialised in electrothermal analysis and transient measurements, and a major research institution contributing in the fabrication of test dies and tool integration. Most partners have a long history in successful co-operation in related fields.
Start date:	2000.01.01
End date:	2002.12.31
Duration:	36 months
Project status:	Execution
Project cost:	3.44 million euro
Project funding:	1.80 million euro
Programme type:	5th FWP (Fifth Framework Programme)
Subprogramme area:	Peripherals, sub-systems and microsystems - Subsystems technologies
Contract type:	CSC (Cost-sharing contracts)
Prime contractor:	Philips Electronics Nederland B.V., Philips Research
Organisation type:	Other
Country:	NETHERLANDS
Region:	ZUID-NEDERLAND, NOORD-BRABANT, Zuidoost-Noord-Brabant
City:	Eindhoven
Post Code:	5621 JG
Address:	Boschdijk 525, POSTBUS 90050
Contact person:	LASANCE, Clemens
Telephone:	+31-40-2742795
Fax:	+31-40-2745002
E-mail:	clemens.lasance@philips.com
Contractor:	Nokia Corporation, Nokia Research Center
Organisation type:	Industry
Country:	FINLAND
Region:	MANNER-SUOMI, UUSIMAA
City:	Espoo
Post Code:	02150
Address:	Keilalahdentie 4, P.O. BOX 226
Contact person:	LOHAN, John
Telephone:	+358-405-743899
Fax:	+358-9-43766067
E-mail:	john.lohan@nokia.com
Contractor:	Centre for Quantitative Methods B.V.
Organisation type:	Other
Country:	NETHERLANDS
Region:	ZUID-NEDERLAND, NOORD-BRABANT, Zuidoost-Noord-Brabant
City:	Eindhoven
Post Code:	5600 AK
Address:	Vonderweg 11, PO Box 414
Contact person:	DEN HERTOG, Dick
Telephone:	+31-40-2758705
Fax:	+31-40-2758712
E-mail:	denhertog@CQM.nl
Contractor:	Institut National Polytechnique de Grenoble, Tima
Organisation type:	Education
Country:	FRANCE
Region:	CENTRE-EST, RHÔNE-ALPES, Isčre
City:	Grenoble Cedex
Post Code:	38031
Address:	46 Avenue Felix Viallet
Contact person:	COURTOIS, Bernard
Telephone:	+33-4-76574615
Fax:	+33-4-76473814
E-mail:	bernard.courtois@imag.fr
Contractor:	Philips Semiconductors B.V., ATO-Innovation Nijmegen
Organisation type:	Other
Country:	NETHERLANDS
Region:	ZUID-NEDERLAND, NOORD-BRABANT, Zuidoost-Noord-Brabant
City:	Eindhoven
Post Code:	5652 AH
Address:	Hurksestraat 19, PO Box 218
Contact person:	JANSSEN, John
Telephone:	+31-24-3532516
Fax:	+31-24-3633360
E-mail:
Contractor:	Infineon Technologies Ag, B QIP SIM
Organisation type:	Industry
Country:	GERMANY
Region:	BAYERN, OBERBAYERN, München, Kreisfreie Stadt
City:	Muenchen
Post Code:	81541
Address:	St. Martin Strasse 53, Postfach 800949
Contact person:	PAPE, Heinz
Telephone:	+49-8941-445157
Fax:	+49-8941-442260
E-mail:
Contractor:	St Microelectronics S.r.l., Corporate Package Development
Organisation type:	Other
Country:	ITALY
Region:	LOMBARDIA
City:	Agrate Brianza
Post Code:	20041
Address:	Via C. Olivetti 2
Contact person:	VILLA, Claudio Maria
Telephone:	+39-03-9303349
Fax:
E-mail:	claudio-maria.villa@st.com
Contractor:	Flomerics Limited, Product Development
Organisation type:	Other
Country:	UNITED KINGDOM
Region:	SOUTH EAST (UK), SURREY, EAST-WEST SUSSEX, Surrey
City:	Surrey
Post Code:	KT8 9HH
Address:	81 Bridge Road, Hampton Court
Contact person:	PARRY, John
Telephone:	+44-181-9418810
Fax:	+44-181-9418730
E-mail:	john@flomerics.co.uk
Contractor:	Budapest University of Technology and Economics, Department of Electron Devices
Organisation type:	Education
Country:	HUNGARY
Region:	Region not yet available (HUNGARY)
City:	Budapest
Post Code:	1521
Address:	Muegyetem Rakpart 3, PO Box 91
Contact person:	SZEKELY, Vladimir
Telephone:	+36-1-4632702
Fax:	+36-1-4632973
E-mail:	szekely@eet.bme.hu
Contractor:	Micred Microelectronics Research and Development Ltd.
Organisation type:	Other
Country:	HUNGARY
Region:	Region not yet available (HUNGARY)
City:	Budapest
Post Code:	1112
Address:	Gulyas U 27
Contact person:	POPPE, Andreas
Telephone:	+36-1-2560523
Fax:	+36-1-2461770
E-mail:	mail@mired.hu

  ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ...

Source: European Communities, CORDIS